Fuzzy Approach for Reliability Modeling of Lead-Free Solder Joints in Elevated Temperature Environmental Conditions

The mechanical and fatigue properties of microelectronic interconnection materials are important issues in critical applications the life electronic assemblies. Due to growth components new technological products used tough conditions, evaluating reliability solder alloys has become crucial prediction product life. SAC (Sn-Ag-Cu) common lead-free form joints. In current study, individual SAC305 joints actual setting conditions with an organic solderability preservative (OSP) surface finish was examined using accelerated shear test at different load levels (16 MPa, 20 24 MPa). Four operating temperature (−10, 25, 60, 100 °C) were also used. Seven samples utilized each experimental condition. An orthogonal array (L12) employed for this experiment. behavior described by a two-parameter Weibull distribution. characteristic shape parameter extrapolated from distribution Characteristic represent resistance For sample, inelastic work per cycle plastic deformation determined. results indicated notable increase strain as result increasing either stress or working temperature. Combinations amplitude, temperature, work, applied inputs fuzzy system computing comprehensive output measure (COM-Value) Mamdani method. A negative relationship observed between four inputs. To fuzzify system, two membership functions, “MFs”, formed input, five MFs set output. center-of-gravity (COG) theorem defuzzification method inference system. predicted COM-Value, which independent variable. Finally, COM-Value generate general model acceptable adequacy index.